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The Second Industrial Zone
Hangkong Road, Xixiang Town
Bao'an District, Shenzhen City
China


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What are the cooling tips for pcb boards?

Everyone knows that electronic devices generate a certain amount of heat when they work. If the pcb circuit board is always in a high temperature condition, it may cause the components on the board to fail due to overheating. Therefore, the heat dissipation problem of the pcb circuit board is Need to pay great attention. Today, I will introduce you to the cooling skills of the pcb circuit board.


1, through the PCB circuit board itself to dissipate

 

    The boards commonly used for pcb boards are copper-clad, epoxy glass cloth substrates or phenolic glass cloth substrates. Although these substrates have excellent electrical properties and processing properties, they have poor heat dissipation properties. Therefore, in order to solve the heat dissipation problem, the best way is to improve the heat dissipation capability of the PCB itself in direct contact with the heating element, and conduct it through the PCB board or emit it.

 

    2, high heat-generating device plus heat sink, heat-conducting plate

 

    When there are a few devices in the PCB circuit board that generate a large amount of heat (less than 3), a heat sink or a heat pipe can be added to the heat generating device. When the temperature cannot be lowered, a heat sink with a fan can be used. Enhance heat dissipation. When the amount of heat generating devices is large (more than three), a large heat sink (plate) can be used.


    3, using a reasonable wiring design to achieve heat dissipation

 

    Since the resin in the sheet has poor thermal conductivity, and the copper foil line and the hole are good conductors of heat, increasing the copper foil residual ratio and increasing the heat conducting hole are the main means of heat dissipation.

 

    4, according to the size of the heat to arrange components

 

    Devices on the same board should be arranged as much as possible according to their heat generation and heat dissipation. Devices with low heat or poor heat resistance (such as small signal transistors, small scale integrated circuits, etc.) should be placed in the uppermost stream of cooling airflow. (at the entrance), devices with high heat or heat resistance (such as power transistors, large-scale integrated circuits, etc.) are placed at the most downstream of the cooling airflow.

 

    5, to avoid the concentration of hot spots on the PCB circuit board

 

    To maintain uniform and consistent PCB surface temperature performance, distribute power-efficient components evenly on the PCB as much as possible. However, it is often difficult to achieve a strict uniform distribution during the design process, but it is necessary to avoid areas where the power density is too high, so as to avoid the hot spots affecting the normal operation of the entire circuit.


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